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[PT032AHJ], Patent Application, Thomas Alva Edison, February 24th, 1906

Title: [PT032AHJ], Patent Application, Thomas Alva Edison, February 24th, 1906
Author: Edison, Thomas Alva
Mentioned: Edison (Thomas A.) Inc; Dyer, Frank Lewis; Smith, Dyer
Date: 1906-02-24
Type: Patent Application
Subject: Electroplating
Folder ID: PT032AHJ-F
Microfilm ID: 185:131
Document ID: PT032AHJ
URL: https://edisondigital.rutgers.edu/document/PT032AHJ
Rights: Thomas Edison National Historical Park
Publisher: Thomas A. Edison Papers, School of Arts and Sciences, Rutgers University
Has Version: Archive.org Viewer, Microfilm Series Reel 185